25 Years of Microplasma Science and Applications: A Status Report

Authors

  • K. H. Becker Department of Mechanical and Aerospace Engineering and Department of Applied Physics, New York University Tandon School of Engineering, Brooklyn, NY 1120

DOI:

https://doi.org/10.14311/ppt.2018.1.5

Keywords:

microplasma, discharge, plasma, microhollow cathode

Abstract

Microplasmas gained recognition as a distinct area of research within the larger field of plasma science about 25 years ago.  Since then, the activity in microplasma research and applications has continuously increased.  This paper provides a summary of some of the pertinent developments of microplasma sources that have contributed to making this field an exciting and rapidly growing area of interest, both in terms of scientific challenges and technological opportunities.

References

G.P. Slade and E.D. Taylor. IEEE Trans. Compon. Packag. Technol., 25(390), 2002.

D.B. Go and A.D. Pohlman. J. Appl. Phys., 107, 2010.

W. Zhang, T.S. Fisher, and S.V. Garimella. J. Appl. Phys., 96, 2004.

G. Tirumala and D.B. Go. Appl. Phys. Lett., 97, 2010.

K. H. Schoenbach and K. Becker. Europ. Phys. J. D, 70(29), 2016.

A. von Engel. Ionized gases, 1965.

A. Von Engel, R. Seeliger, and M. Steenbeck. Z. Physik, 85(144), 1933.

D. Staack, B. Farouk, A. Gutsol, and A. Fridman.

M. Moselhy and K.H. Schoenbach. J. Appl. Phys., 95, 2004.

K.H. Schoenbach, M. Moselhy, and W. Shi. Plasma Sources Science and Technology, 13, 2004.

L. Baars-Hibbe and P. Sichler et al. J. Phys. D: Appl. Phys., 38, 2005.

C. Schrader and L. Baars-Hibbe et al. Vacuum, 80, 2006.

J. Hopwood, A.R. Hoskinson, and J. Gregorio. Plasma Sources Sci. Technol., 23, 2014.

K.H. Schoenbach and et al R. Verhappen. Appl. Phys. Lett., 1996.

C. Penache and et al M. Miclea. Plasma Sources Science and Technology, 11, 2002.

G. Schaefer and K.H. Schoenbach. Basic Mechanisms Contributing to the Hollow Cathode Effect in Physics and Applications of Pseudosparks. Plenum Press, 1990.

J.P. Boeuf, L.C. Pitchford, and K.H. Schoenbach. Appl. Phys. Lett., 86, 2005.

J.W. Frame and et al D.J. Wheeler. Appl. phys. lett. 71, 1997.

S.-J. Park and J.G. Eden et al. Appl. Phys. Lett., 85, 2004.

J.G. Eden and S.-J. Park. Plasma Physics and Controlled Fusion, 47, 2005.

Z. Yu, K. Hoshimiya, and J.D. Williams et al. 83, 2003.

R. Rahul and O. Stan et al. J. Phys. D: Appl. Phys., 38, 2005.

Y.-B. Guo and F.C.-N. Hong. Appl. phys. lett. 82, 2003.

M. Moselhy and et al W. Shi. IEEE Trans. Plasma Science, 30, 2002.

K.H. Becker and B.B. Godfrey et al. IEEE Trans. Plasma Sci., 43, 2015.

X. Lu, M. Laroussi, and V. Puech. Plasma Sources Sci. Techn., 21, 2012.

K.D. Weltmann and E. Kindel et al. Pure Appl. Chem., 82, 2010.

X. Lu and M. Laroussi. J. Appl. Phys, 100, 2006.

K.D. Weltmann and E. Kindel et al. Contr. Plasma Phys., 49, 2009.

M. Teschke and J. Kedzierski et al. J. Engemann, IEEE Trans. Plasma Sci., 33, 2005.

Downloads

Published

2018-12-11

Issue

Vol. 5 No. 1 (2018)

Section

Articles

License

Authors who publish with this journal agree to the following terms:

  1. Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
  2. Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
  3. Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).