Koleňák, R.; Prach, M.; Kostolný, I. ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS. Acta Polytech 2016, 56 (2), 126-131. https://doi.org/10.14311/AP.2016.56.0126.