Application of cold atmospheric plasma for mold inactivation

Authors

  • Petra Tichá Czech Technical University in Prague, Faculty of Civil Engineering, Department of Physics, Thákurova 7, 166 29 Prague 6, Czech Republic
  • Mária Domonkos Czech Technical University in Prague, Faculty of Civil Engineering, Department of Physics, Thákurova 7, 166 29 Prague 6, Czech Republic
  • Zuzana Rácová Czech Technical University in Prague, Faculty of Civil Engineering, Department of Architectural Engineering, Thákurova 7, 166 29 Prague 6, Czech Republic
  • Pavel Demo Czech Technical University in Prague, Faculty of Civil Engineering, Department of Physics, Thákurova 7, 166 29 Prague 6, Czech Republic

DOI:

https://doi.org/10.14311/APP.2023.40.0093

Keywords:

cold atmospheric plasma, mold, spore, inactivation, mold growth curve

Abstract

Mold growth in indoor interiors is an increasing problem that has adverse effects on both occupants and building materials. The aim of this study was to present the new environmentally friendly method (cold atmospheric plasma treatment) for decontamination of indoor environments contaminated by mold spores, with the potential to become an effective replacement for conventional methods, such as ultraviolet-C (UV-C) germicidal irradiation. The spores of Aspergillus species on malt extract agar plates were exposed to plasma produced by diffuse coplanar surface barrier discharge. The surface coverage of mold was evaluated using image analysis. Cold plasma treatment inactivated spores on the surface of the culture medium in 0.5 min, whereas a weak growth delay was observed after 30 minute exposure to UV-C irradiation. This study demonstrated that cold atmospheric plasma is a more effective method for reducing mold spores on agar compared with germicidal UV-C irradiation.

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Published

2023-07-24

How to Cite

Tichá, P., Domonkos, M., Rácová, Z., & Demo, P. (2023). Application of cold atmospheric plasma for mold inactivation. Acta Polytechnica CTU Proceedings, 40, 93–97. https://doi.org/10.14311/APP.2023.40.0093