Conductivity Measurements of Silverpastes

M. Dirix, O. Koch

Abstract


The development of three-dimensional printed circuit boards requires research on new materials which can easily be deformed. Conducting pastes are well suited for deformation even after they are applied to the dielectric carrier. This paper deals with measurements of the electrical conductivity of these conducting pastes. Two different conductivity measurement techniques are explained and carried out. The resulting measurements give an overview of the conductivity of several measured samples.

Keywords


conductivity; conducting pastes; 3d circuits

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ISSN 1210-2709 (Print)
ISSN 1805-2363 (Online)
Published by the Czech Technical University in Prague