Conductivity Measurements of Silverpastes

Authors

  • M. Dirix
  • O. Koch

DOI:

https://doi.org/10.14311/1221

Keywords:

conductivity, conducting pastes, 3d circuits

Abstract

The development of three-dimensional printed circuit boards requires research on new materials which can easily be deformed. Conducting pastes are well suited for deformation even after they are applied to the dielectric carrier. This paper deals with measurements of the electrical conductivity of these conducting pastes. Two different conductivity measurement techniques are explained and carried out. The resulting measurements give an overview of the conductivity of several measured samples.

Author Biographies

M. Dirix

O. Koch

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Published

2010-01-04

Issue

Section

Articles