A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

M. Provazník, R. Koleňák

Abstract


This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

Keywords


ultrasonic activation; active solder; ITO (indium-tin oxide) ceramics

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ISSN 1210-2709 (Print)
ISSN 1805-2363 (Online)
Published by the Czech Technical University in Prague